Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push
Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030. The company stated, "The expanded collaboration … reflects Samsung's focus on supporting customers with end-to-end semiconductor technologies across an increasingly diverse range of AI and high-performance computing applications."
The tie-up comes as global technology companies increasingly develop their own custom AI accelerators. The next five years of collaboration will combine Broadcom's expertise in designing application-specific integrated circuits (ASICs) with Samsung's manufacturing capabilities. The deal provides for Broadcom's next-generation communications chips to be made with Samsung's sub-2-nanometre process technology. The two will also collaborate on next-generation high-bandwidth memory (HBM) products.
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Samsung Electronics and U.S. chip designer Broadcom are set to expand their cooperation across memory chips, contract chip making, and advanced
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